- All sections
- H - Electricity
- H04B - Transmission
- H04B 1/036 - Cooling arrangements
Patent holdings for IPC class H04B 1/036
Total number of patents in this class: 137
10-year publication summary
|
11
|
10
|
7
|
13
|
10
|
17
|
20
|
9
|
13
|
9
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Huawei Technologies Co., Ltd. | 100781 |
11 |
| Qualcomm Incorporated | 76576 |
8 |
| Samsung Electronics Co., Ltd. | 131630 |
7 |
| Snap Inc. | 4604 |
5 |
| Raytheon Company | 8535 |
4 |
| Ubiquiti Inc. | 331 |
4 |
| Telefonaktiebolaget LM Ericsson (publ) | 26435 |
4 |
| Ericsson | 20417 |
3 |
| Sumitomo Electric Industries, Ltd. | 14131 |
3 |
| Murata Manufacturing Co., Ltd. | 22355 |
3 |
| KMW Inc. | 626 |
3 |
| Wytec International Inc | 5 |
3 |
| LG Electronics Inc. | 69257 |
2 |
| Dell Products L.P. | 11144 |
2 |
| LG Innotek Co., Ltd. | 6758 |
2 |
| Airgain, Inc. | 294 |
2 |
| Audi AG | 7153 |
2 |
| EBM-Papst St. Georgen GmbH & Co. KG | 286 |
2 |
| Honeywell Federal Manufacturing & Technologies, LLC | 276 |
2 |
| Laird Technologies, Inc. | 385 |
2 |
| Other owners | 63 |